In the field of electronic product reliability and failure analysis, we offer a variety of services and equipment, including: Foreign Material Analysis utilizing X-ray Fluorescence Spectrometers, Infrared Spectrometers, and Raman Spectrometers; Non-destructive Testing with X-ray Fluorescence Detectors, CT Scanners, and Three-dimensional Ultrasonic Testers; Ionic Migration Testing Systems, Conductance Resistance Testing Systems, Solderability Tests, Thermal Shock Chambers, Constant Temperature and Humidity Chambers, High Accelerated Life Test Chambers, Metallographic Analysis, Scanning Electron Microscopes, Tensile Testing Machines, and more.